高通發(fā)布新款芯片驍龍835

Thinner smartphones or more space for larger batteries are on the way this year, thanks to a big reduction in the size of the latest mobile processors that power them.

今年智能手機的趨勢是機身更薄、或者留給電池的空間更大，這多虧了最新的移動處理器(為智能手機提供計算能力)大幅縮減尺寸。

Qualcomm, the leading mobile chipmaker, said on Tuesday that the new version of its flagship processor — the Snapdragon 835 — would take up about 35 per cent less space than last year’s model and consume roughly 25 per cent less power.

美國領先的手機芯片制造商高通(Qualcomm)周二表示，其旗艦處理器驍龍835(Snapdragon 835)的新版本比去年的版本體積減少約35%，耗電量減少約25%。

Battery life has become mobile users’ biggest pain point, as people make ever greater demands of their smartphones.

隨著人們對智能手機的期望越來越高，電池的續(xù)航能力已經(jīng)成為了手機用戶最大的痛點。

The latest Qualcomm chip, unveiled at the Consumer Electronics Show (CES) in Las Vegas, has made an unusually big leap in energy efficiency, Keith Kressin, senior vice-president of product management for Snapdragon, told the FT in an interview — using about half the power of similar processors just a few years ago.

高通負責驍龍產(chǎn)品管理的高級副總裁基思•克賴申(Keith Kressin)在接受英國《金融時報》(Financial Times)采訪時表示，在拉斯維加斯的消費電子展(CES)上發(fā)布的高通最新款芯片，在能源效率上實現(xiàn)了巨大飛躍，耗電量約為幾年前類似處理器的一半。

“It’s really hard to do that level of jump year in, year out,” he said. “This is a big one.”

“年復一年地實現(xiàn)這種水平的飛躍，真的很難，”他表示，“這是一次巨大飛躍。”

Handset makers are looking for new ways to differentiate themselves, to attract customers back to a slowing smartphone market. Qualcomm’s customers, which include Samsung, LG and Xiaomi, tend to employ its latest Snapdragon chips in their flagship devices. The first smartphones to take advantage of the new capabilities are expected to launch in the first half of 2017.

手機制造商正在尋找實現(xiàn)差異化的新方式，以吸引消費者回到日益放緩的智能手機市場。高通的客戶(包括三星(Samsung)、LG和小米(Xiaomi))往往在旗艦產(chǎn)品中采用最新的驍龍芯片。首款利用上新款驍龍芯片強勁性能的智能手機，預計將于2017年上半年面世。